0.635 mm间距开放式端子阵列
性能可达56 Gbps NRZ/112 Gbps PAM4
成本优化解决方案
薄度为5 mm,堆叠高度为10 mm
提供800个总端子数; 进程计划达到超过1,000个端子
数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容
Analog Over Array™能力

AcceleRate® HP 0.635 mm间距阵列具有112 Gbps PAM4的极致性能以及灵活的开放式端子设计。
0.635 mm间距开放式端子阵列
性能可达56 Gbps NRZ/112 Gbps PAM4
成本优化解决方案
薄度为5 mm,堆叠高度为10 mm
提供800个总端子数; 进程计划达到超过1,000个端子
数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容
Analog Over Array™能力

As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。
零件编号:REF-231683-X.XX-XX

As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。
零件编号:REF-230038-X.XX-XX

Samtec 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays support high-performance applications with maximum routing and grounding flexibility via an open-pin-field design. The AcceleRate® HP SI Evaluation Kit (REF-218313-X.XX-XXX) provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® HP connectors. The AcceleRate® HP SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。
零件编号:REF-218313-X.XX-XXX

性能可达56 Gbps NRZ/112 Gbps PAM4
数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容
提供800个总端子数; 进程计划达到超过1,000个端子
Open-pin-field design for maximum grounding and routing flexibility
薄度为5 mm,堆叠高度为10 mm
Solder column board termination for extreme reliability; IPC Class 3 compliant, surface mount reflow technique for high-density, high-speed connectors
额定电流:最大1.2 A
额定电压:最大150 VAC/212 VDC
Analog Over Array™能力
性能可达56 Gbps NRZ/112 Gbps PAM4
数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容
提供800个总端子数; 进程计划达到超过1,000个端子
Open-pin-field design for maximum grounding and routing flexibility
薄度为5 mm,堆叠高度为10 mm
Solder column board termination for extreme reliability; IPC Class 3 compliant, surface mount reflow technique for high-density, high-speed connectors
额定电流:最大1.2 A
额定电压:最大150 VAC/212 VDC
Analog Over Array™能力
性能可达56 Gbps NRZ/112 Gbps PAM4
数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容
4排设计;每排10 - 100个针位
Open-pin-field design for maximum grounding and routing flexibility
Available as a panel mount mate for AcceleRate® Cable (ARP6): 4 row only with 25 or 37 positions per row, requires APF6-C cage
额定电流:最大1.2 A
额定电压:最大150 VAC/212 VDC
Analog Over Array™能力
允许有0.035"的初始错位;对齐在连接器咬合前开始
借助“盲插”处理超微型细间距夹层连接器
4 mm - 30 mm堆叠高度
MIL-DTL不锈钢
可与NVAM/NVAF、APM6/APF6、ADM6/ADF6和UMPT/UMPS良好对接