AcceleRate® HP高性能阵列

AcceleRate® HP 0.635 mm间距阵列具有112 Gbps PAM4的极致性能以及灵活的开放式端子设计。

查看全系列AcceleRate®产品。

特色

  • 0.635 mm间距开放式端子阵列

  • 性能可达56 Gbps NRZ/112 Gbps PAM4

  • 成本优化解决方案

  • 薄度为5 mm,堆叠高度为10 mm

  • 提供800个总端子数; 进程计划达到超过1,000个端子

  • 数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容

  • Analog Over Array™能力

  • 查看全系列AcceleRate®产品

AcceleRate® HP

评估和开发套件

AcceleRate® HP Flyover® SI评估套件

As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。

零件编号:REF-231683-X.XX-XX

AcceleRate® HP Flyover® SI评估套件

As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。

零件编号:REF-230038-X.XX-XX

AcceleRate® HP SI评估套件

Samtec 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays support high-performance applications with maximum routing and grounding flexibility via an open-pin-field design. The AcceleRate® HP SI Evaluation Kit (REF-218313-X.XX-XXX) provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® HP connectors. The AcceleRate® HP SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec's technical experts at [email protected] 联系Samtec的技术专家。

零件编号:REF-218313-X.XX-XXX

下载和资源

资料

高速板对板<br/>解决方案指南

高速板对板
解决方案指南

下载PDF文件
Analog Over Array™电子手册

Analog Over Array™电子手册

下载PDF文件
Mezzanine Stacking Connectors eBrochure

Mezzanine Stacking Connectors eBrochure

下载PDF文件

技术文档

视频

Samtec高级互联设计技术中心
Samtec高级互联设计技术中心

产品

APM6

0.635mm AcceleRate ® HP高性能阵列针脚
特色
  • 性能可达56 Gbps NRZ/112 Gbps PAM4

  • 数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容

  • 提供800个总端子数; 进程计划达到超过1,000个端子

  • Open-pin-field design for maximum grounding and routing flexibility

  • 薄度为5 mm,堆叠高度为10 mm

  • Solder column board termination for extreme reliability; IPC Class 3 compliant, surface mount reflow technique for high-density, high-speed connectors

  • 额定电流:最大1.2 A

  • 额定电压:最大150 VAC/212 VDC

  • Analog Over Array™能力

  • 查看全系列AcceleRate®产品

APM6-系列图片

APF6

0.635mm AcceleRate® HP垂直高性能阵列插座
特色
  • 性能可达56 Gbps NRZ/112 Gbps PAM4

  • 数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容

  • 提供800个总端子数; 进程计划达到超过1,000个端子

  • Open-pin-field design for maximum grounding and routing flexibility

  • 薄度为5 mm,堆叠高度为10 mm

  • Solder column board termination for extreme reliability; IPC Class 3 compliant, surface mount reflow technique for high-density, high-speed connectors

  • 额定电流:最大1.2 A

  • 额定电压:最大150 VAC/212 VDC

  • Analog Over Array™能力

  • 查看全系列AcceleRate®产品

APF6-系列图片

APF6-RA

0.635mm AcceleRate® HP直角高性能阵列插座
特色
  • 性能可达56 Gbps NRZ/112 Gbps PAM4

  • 数据速率与PCIe® 6.0/CXL® 3.2和100 GbE兼容

  • 4排设计;每排10 - 100个针位

  • Open-pin-field design for maximum grounding and routing flexibility

  • Available as a panel mount mate for AcceleRate® Cable (ARP6): 4 row only with 25 or 37 positions per row, requires APF6-C cage

  • 额定电流:最大1.2 A

  • 额定电压:最大150 VAC/212 VDC

  • Analog Over Array™能力

  • 查看全系列AcceleRate®产品

APF6-RA产品图片

GPSO

SureWare™导柱架高
特色
  • 允许有0.035"的初始错位;对齐在连接器咬合前开始

  • 借助“盲插”处理超微型细间距夹层连接器

  • 4 mm - 30 mm堆叠高度

  • MIL-DTL不锈钢

  • 可与NVAM/NVAF、APM6/APF6、ADM6/ADF6和UMPT/UMPS良好对接

GPSO-产品图片

GPSK

SureWare™直角导柱插座
特色
GPSK-产品图片

GPPK

SureWare™导柱,与GPSK对接
特色
GPPK-产品图片

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